Compressible MicroInterconnects

Wearable electronics pose certain challenges to existing methods of fabrication. Most devices still rely on outdated, soldered connections to conduct electricity, which create physical bumps and can prove unreliable when these interconnections are stressed by movement.

Compressible MicroInterconnects, from Georgia Tech, is developing an interconnections technology for a wide array of applications, compensating for varied surfaces and granting a high degree of flexibility for wearable and stretchable electronics. Fabrication is cheap and highly customizable. The wearable computing market is growing at an annual compound rate of 20%, creating a great need for this kind of innovation.